Levert, Joseph A., Grosso, Andy, "NYSID’s Project CREATE: An Organizational Model
for Service Learning through Assistive Technology Development", American Society of Engineering Educators, Zone 1 Conference Proceedings, April, 2014.
Levert, J.; Korach, C., "CMP Friction as a Function of Slurry Silica Nanoparticle
Concentration and Diameter", STLE Tribology Transactions, Volume 52, Issue 2, Pages 256 – 261, 2009
DeBear, D.S.; Levert, J.A.; Mukherjee; S.P.; "Spin-Etch Planarization for Dual Damascene
Interconnect Structures", Solid State Technology, March, 2000, PP 53-60.
Levert, J.A.; Mukherjee; S.P.; DeBear, D.S.; Fury, M.; "A Novel Spin-Etch Planarization
Process for Dual-Damascene Copper Interconnects" Interconnect and Contact Metallization for ULSI - Proceedings of The Electrochemical
Society, Vol. 99-31, PP 162-173, (2000).
Shan, L.; Levert, J.A.; Meade, L.; Tichy, J.; Danyluk, S.; "Interfacial Fluid Mechanics
and Pressure Prediction in Chemical Mechanical Polishing", ASME Journal of Tribology, Vol. 122, July, 2000, PP 539-543. Received best paper award from ASME Tribology
division.
Levert, J.A.; Danyluk, S.; Tichy, J.; "Mechanism for Subambient Interfacial Pressures
While Polishing with Liquids", ASME Journal of Tribology, Vol. 122, April, 2000, PP 450-457.
Levert, J.A.; Baker R.; Mess, F.; Salant R.; Danyluk, S.; "Mechanisms of Chemical-Mechanical
Polishing of SiO2Dielectric on Integrated Circuits", STLE Tribology Transactions, Vol. 41 (1998), 4, 593 - 599.
Patents (US)
6,869,347; March 22, 2005; Koinkar, Collins, Costa, Levert; "Fabrication of devices
with fibers engaged to grooves on substrates"
6,771,874; August 3, 2004; Levert, Talmadge; "Tension-assisted mounting of fibers
on a substrate".
6,719,608; April 13, 2004; Koinkar, Costa, Collins, Levert; "Fabrication of devices
with fibers engaged to grooves on substrates".
6,696,358; February 24, 2004; Mukherjee, Levert, DeBear; "Viscous protective overlayers
for planarization of integrated circuits".
6,630,433; October 7, 2003; Zhang, Towery, Levert, Mukherjee; "Composition for chemical
mechanical planarization of copper, tantalum and tantalum nitride".
6,600,229; July 29, 2003; Mukherjee, Levert, DeBear; "Planarizers for spin etch planarization
of electronic components".
6,407,006; June 18, 2002; Levert, Towery, Endisch; "Method for integrated circuit
planarization".